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Ublox NEO-F10N User Manual

Ublox NEO-F10N
42 pages
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NEO-F10N
Standard precision GNSS module
Professional grade
Integration manual
Abstract
This document describes the features and application of the u-blox NEO-
F10N module, an L1/L5 dual-band GNSS receiver for meter-level accuracy
in urban environment.
www.u-blox.com
UBXDOC-963802114-12193 - R02
C1-Public
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Ublox NEO-F10N Specifications

General IconGeneral
Concurrent ReceptionYes
Assisted Starts2 s
Velocity Accuracy0.05 m/s
Heading Accuracy0.3 degrees
Time Accuracy20 ns
Dimensions12.2 x 16.0 x 2.4 mm
GNSS SupportGPS, GLONASS, Galileo, BeiDou
FrequencyL1
InterfaceUART, SPI, I2C
Operating Temperature-40°C to 85°C
Current Consumption25 mA
ProtocolsNMEA, UBX

Summary

1 System description

1.1 Overview

Provides an overview of the NEO-F10N module's features and capabilities.

1.2 Architecture

Details the receiver's architecture and key functionality, including the block diagram.

1.3 Pin definition

Details the pin assignment and functionality of the NEO-F10N module.

2 Receiver configuration

2.1 Basic receiver configuration

Summarizes common receiver configurations, including LNA modes and GNSS signal settings.

2.2 Navigation configuration

Covers configuration options for the navigation engine, including dynamic platforms and filters.

3 Receiver functionality

3.1 Communication interfaces and PIOs

Details UART and PIO interfaces, including specific pins like RESET_N and LNA_EN.

3.2 Forcing receiver reset

Explains different receiver reset types (cold, warm, hot) and their effects.

3.3 Power management

Describes continuous and backup operating modes, including hardware and software standby.

4 Hardware integration

4.1 Power supply

Explains the VCC and V_BCKP power supply pins and their functions.

4.2 RF front-end

Covers RF input design, LNA modes, and out-of-band interference immunity.

4.3 Layout

Provides guidelines for PCB layout, grounding, and component placement for optimal performance.

5 Product handling

5.1 Safety

Details critical safety precautions, including ESD protection and handling guidelines.

5.2 Packaging

Describes module packaging, reels, tapes, moisture sensitivity, and soldering procedures.

Cleaning

Provides instructions on cleaning the module, warning against water, solvents, and ultrasonic methods.

Repeated reflow soldering

Discourages repeated reflow soldering or upside-down soldering of the module.

Wave soldering

Discusses wave soldering for base boards with THT components and modules.

Rework

Advises against using hot air guns for rework and recommends cleaning pads after module removal.

Conformal coating

Explains the impact of conformal coating on RF properties and voids warranty.

Casting

Recommends specific silicon pottants for casting and advises qualifying processes.

Grounding metal covers

Discusses grounding attempts and u-blox's warranty for damages from soldering metal strips.

Appendix

A Migration

Describes important differences and considerations when migrating from u-blox M8 to u-blox F10.

B Reference designs

Provides specifications and recommendations for external components used in reference designs.

C External components

Lists recommended values for external components like capacitors, resistors, inductors, and transistors.

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Revision history

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