NEO-F10N-Integration manual
High temperature drift and air vents can affect the GNSS performance. For best performance,
avoid high temperature drift and air vents near the module.
4.3.1 Package footprint, copper and solder mask
The mechanical specification is available in the data sheet [1].
Figure 9 and Figure 10 describe the footprint and provide recommendations for the paste mask.
Note that the copper and solder masks have the same size and position.
Figure 9: Recommended copper land and solder mask opening for NEO-F10N
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase it outside of the module by defining the dimensions of the paste mask to form a T-shape
(or equivalent) extending beyond the copper mask.
Recommended stencil thickness is 150 µm.
UBXDOC-963802114-12193 - R02
4 Hardware integration Page 26 of 42
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