EasyManua.ls Logo

Ublox SARA-G340 ATEX

Ublox SARA-G340 ATEX
217 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
Loading...
SARA-G3 and SARA-U2 series
GSM/GPRS and GSM/EGPRS/HSPA
Cellular Modules
System Integration Manual
Abstract
This document describes the features and the system integration of
the SARA-G3 series GSM/GPRS cellular modules and the SARA-U2
GSM/EGPRS/HSPA cellular modules.
These modules are complete and cost efficient solutions offering
voice and/or data communication over diverse cellular radio access
technologies in the same compact SARA form factor: the SARA-G3
series support up to four GSM/GPRS bands, while the SARA-U2
series support up to five high-speed HSPA bands and up to four
GSM/EGPRS bands.
www.u-blox.com
UBX-13000995 - R26

Table of Contents

Question and Answer IconNeed help?

Do you have a question about the Ublox SARA-G340 ATEX and is the answer not in the manual?

Ublox SARA-G340 ATEX Specifications

General IconGeneral
CategoryControl Unit
ModelSARA-G340 ATEX
ManufacturerUblox
TechnologyGSM/GPRS
Operating Temperature-40°C to +85°C
SMS SupportYes
CertificationATEX
Frequency BandsGSM 850/900/1800/1900 MHz
Power Supply3.3 V to 4.5 V
InterfaceUART, I2C
Data TransferGPRS Class 10
Data Rate85.6 kbps (DL)

Summary

System Description

Pin-out

Lists the pin-out of SARA-G3 and SARA-U2 modules, grouped by function.

Supply interfaces

Details the module power supply input (VCC) for SARA-G3 and SARA-U2 series.

Antenna interface

Covers the ANT pin and its requirements for RF signals reception and transmission.

SIM interface

Covers the SIM interface, including automatic detection and voltage switch.

Design-in

Supply interfaces

Details the guidelines for VCC supply circuit selection and design.

Antenna interface

Provides general guidelines for antenna selection and RF interface design.

SIM interface

Covers guidelines for SIM circuit design, connectors, and chip selection.

Serial interfaces

Covers guidelines for UART circuit design for RS-232 functionality.

Module placement

Provides guidelines for optimizing module placement for RF and thermal performance.

Thermal guidelines

Provides thermal guidelines for module operation and heat dissipation.

ESD guidelines

Covers ESD immunity test overview and requirements.

Handling and Soldering

Soldering

Details soldering recommendations, including paste and reflow profiles.

Product testing

Related product manuals