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General| Technology | GSM/GPRS |
|---|---|
| Power Supply | 3.3V to 4.5V |
| Operating Temperature | -40°C to +85°C |
| GPRS Class | Class 10 |
| SIM Interface | 1.8V/3V |
| Frequency Bands | 850/900/1800/1900 MHz |
| Interface | UART, USB |
| Output Power | GSM850/900: 33 dBm, GSM1800/1900: 30 dBm |
| Weight | 3.0 g |
| Certifications | GCF, CE, FCC, PTCRB, IC |
| Data Rate | GPRS multi-slot class 12 (up to 85.6 kbps downlink, up to 42.8 kbps uplink) |
Overview of available technical documentation for u-blox cellular products.
Guidance on navigating the System Integration Manual structure and symbols.
Information on how to contact u-blox technical support for assistance.
Introduction to SARA-G3 and SARA-U2 series cellular modules and their features.
Details on the internal architecture and block diagrams of the modules.
Comprehensive list of module pins grouped by function and their descriptions.
Description of the different operating modes and transitions between them.
Guidelines and requirements for module power supply (VCC) and related circuits.
Details on module power-on, power-off, and reset functions.
Requirements and guidelines for connecting the antenna RF interface.
Information on SIM card interface and detection functionality.
Overview of UART, Auxiliary UART, USB, and DDC interfaces.
Details on analog and digital audio interfaces and voice-band processing.
Configuration and usage of GPIO pins for various functions.
Overview of advanced system features like TCP/IP, SSL/TLS, temperature management.
General guidelines for optimal module integration into application boards.
Detailed guidelines for designing VCC, V_BCKP, and V_INT supply circuits.
Design considerations for power-on, reset, and clock signal interfaces.
Guidelines for antenna selection, RF interface design, and layout.
Design guidelines for SIM card connections, including detection.
Design guidelines for UART, Auxiliary UART, USB, and DDC (I2C) interfaces.
Design guidelines for analog and digital audio interfaces.
Design guidelines for using GPIO pins.
Recommendations for optimal module placement on the PCB.
Guidance on PCB footprint and paste mask layout for module soldering.
Recommendations for managing module temperature and thermal dissipation.
Precautions and circuit examples for Electro-Static Discharge (ESD) protection.
Specific guidelines for integrating ATEX modules in explosive environments.
Example schematic diagrams for module integration into application boards.
Checklists for schematic and layout design to ensure proper implementation.
Information on handling, packaging, and storage of modules.
Precautions for handling ESD-sensitive modules.
Recommendations for reflow soldering, paste, and profile.
Overview of product certification schemes and requirements.
FCC compliance information and warnings for US market.
ISED Canada compliance information and warnings.
CE marking compliance and relevant European standards.
Anatel certification details for specific modules.
Compliance with Australian telecommunications standards.
Mexican IFT certification number for SARA-U260 module.
CCC mark certification for specific modules for China.
KCC certification for SARA-U270 module.
NCC certification IDs for SARA-G3 and SARA-U2 modules.
Giteki certification details for SARA-U201 modules.
Conformance of ATEX modules for use in potentially explosive atmospheres.
Description of u-blox's automatic in-series production testing procedures.
Key parameters for OEM manufacturers to verify during device assembly.
Overview of migrating from LISA to SARA-G3 modules.
Overview of migrating between SARA-G3 and SARA-U2 modules due to form factor compatibility.
Glossary of technical terms and acronyms used in the document.
