SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Page 5 of 157
2.8.2 Guidelines for general purpose input/output layout design ................................................................... 112
2.9 Reserved pins (RSVD) ............................................................................................................................................................ 113
2.10 Module placement .................................................................................................................................................................. 113
2.11 Module footprint and paste mask .................................................................................................................................. 114
2.12 Thermal guidelines ................................................................................................................................................................. 115
2.13 Schematic for SARA-R4/N4 series module integration ......................................................................................... 116
2.13.1 Schematic for SARA-R4/N4 series modules ..................................................................................................... 116
2.14 Design-in checklist .................................................................................................................................................................. 118
2.14.1 Schematic checklist ...................................................................................................................................................... 118
2.14.2 Layout checklist .............................................................................................................................................................. 118
2.14.3 Antenna checklist .......................................................................................................................................................... 119
3 Handling and soldering ................................................................................................................ 120
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................................. 120
3.2 Handling ...................................................................................................................................................................................... 120
3.3 Soldering ..................................................................................................................................................................................... 122
3.3.1 Soldering paste .............................................................................................................................................................. 122
3.3.2 Reflow soldering ............................................................................................................................................................ 122
3.3.3 Optical inspection ......................................................................................................................................................... 124
3.3.4 Cleaning ............................................................................................................................................................................. 124
3.3.5 Repeated reflow soldering ........................................................................................................................................ 124
3.3.6 Wave soldering .............................................................................................................................................................. 124
3.3.7 Hand soldering ............................................................................................................................................................... 125
3.3.8 Rework ................................................................................................................................................................................ 125
3.3.9 Conformal coating ........................................................................................................................................................ 125
3.3.10 Casting................................................................................................................................................................................ 125
3.3.11 Grounding metal covers ............................................................................................................................................ 125
3.3.12 Use of ultrasonic processes ...................................................................................................................................... 126
4 Approvals......................................................................................................................................... 127
4.1 Product certification approval overview ....................................................................................................................... 127
4.2 US Federal Communications Commission notice .................................................................................................... 130
4.2.1 Safety warnings review the structure .................................................................................................................. 130
4.2.2 Declaration of Conformity ........................................................................................................................................ 130
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