YOKOGAWA Centum V - Page 16

4. Procedure and Details of Upgrade
4-3
TI 33K01B10-50E
Facility Conditions Check
• Checkinsideandoutsideofthecabinetorotherhousingfordustaccumulationonthelters
and fans, as well as corrosion on terminal screws.
• Checkthecardsurfacefordustaccumulation.
• Checktheprintpatternsforpeelingandcorrosion.
• Checksolderedpointsforcreep.
• CheckthesurfacesofpartsforcorrosioninICleads.
• Checkcontactareas(foulingofgoldplateconnectors,holesduetocorrosion).
• Checktheredstampforcondensation.
• Checkcoatedareasfordiscolorationandcracks(*1).
*1: Only for cards with coating treatment.
Note: Electricalwiringandsignalwiring(toconnectI/Osignalstoelddevices)arenotcheckedbyInstallationEnvironmentCheck.
Mar. 27, 2015-00