Hardware Specifications and Configurations 1-25
System Board Major Chips
Processor
Processor Specifications
Item Specification
Core logic Intel HM55 (Ibex-Peak)
Package 27 x 25 mm (MAX), 1071-pin FCBGA
VGA
Build-in Intel HM55 (Ibex-Peak)
ATI Mobility RadeonTM HD 5470 (AMD Park XT); discrete
LAN AR8158L
USB 2.0 Embedded in PCH
Super I/O controller Intel Calpella
Bluetooth N/A
Wireless Intel 802.11ABG 512AG_MMWG, Broadcom BCM57780
PCMCIA N/A
Audio codec Realtek HD codec
Card reader AU6435-GDL
eSata N/A
Item Specification
CPU type Intel Arrandale
CPU package 989-pin Micro-FCPGA
Core Logic
Two execution cores
A 32-KB instruction and 32-KB data first cache (L1) for each core
A 256-KB shared instruction/data second-level cache (L2) for each core
Up to 4-MB shared instruction/data third-level cache (L3), shared among
all cores
Chipset Intel HM55
Item CPU
Speed
(GHz)
Cores/
Threads
Bus
Speed
(FSB/
DMI/QBI
)
Mfg
Tech
(nm)
Cache
Size
Package Voltage
Core
i3-380M
2.53 2 1066
MHz
32 3MB L2 Micro-FCP
GA
0.775V ~
1.4V
Pentium
Dual-Core
P6200
2.13 2 800 MHz 32 3MB L2 Micro-FCP
GA
0.775V ~
1.4V