18 Chapter 1
Hardware Specifications and Configurations
Processor
CPU Fan True Value Table
• Throttling 50%: On =100°C ; Off=90°C
• OS Shut down: 125C
• H/W Shut down: 125C
• Fan default: 5V
Northbridge
Item Specification
CPU type AMD S1g2 Processor (Griffin Series-Turion/Sempron), T3(1.2~2.6G/s)
(Bandwidth:9.6GB/s to 20.8GB/s)
CPU Features • Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form
1.2Ghz to 2.6Ghz
• 64-bit or 128-bit DDR2 Memory Interface, Two independent 64 Bit DDR2
channels
• Split Power Planes, Separate power planes providesd for each CPU core and
on die Northbridge
• Up to 2 processor core per die, Upto 1MB L2 cache per die
• Each CPU core supports up to 8 P-states: P0 (Highest performance) and
P7 (Lowest)
Power
• VDD0,VDD1 set according to the respective P-stage control when core VDD
are isolated and VDD set according to the CPU core in the highest
performance P-state when VDD is common
• CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface
SMDDR_VTEM
CPU package AMD 638-pin micro PGA
Level Fan On Temp. Fan Off Temp. RPM Throttling dB(A)
1 50 45 2300 31
2 60 55 2600 34
3 70 65 2800 37
4 80 75 3100 40
Item Specification
Chipset AMD RS780MN
Features
• CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport
3.0 interface up to 5.2GT/s
• PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and
general purpose link performance, Highly flexible PCI Express
implementation to suit a variety of platform needs
Power 1.1V,1.2V, 1.8V, 3.3V
Package FCBGA 528-pin
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