Agilent Technologies HP 83711B Service Guide

Figures
2. HP
83731A/B,
HP
83732A/B
Overall
Block
Diagram
F
oldout
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2-3
3-1. Major
Assemblies {
T
op
View
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3-2
3-2. Major
Assemblies {
Bottom
View
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. 3-3
3-3. Cable
Assemblies {
Top
View
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3-4
3-4. Cable
Assemblies {
Bottom View
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. 3-5
4-1. Major
Assemblies
Location
Diagram
(T
op
View)
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4-8
4-2. Major
Assemblies
Location
Diagram
(Bottom
View)
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4-10
4-3. Cable
Assemblies
Location
Diagram
(T
op
View)
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4-12
4-4.
Cable
Assemblies
Location
Diagram
(Bottom
View)
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4-14
4-5.
Figures
Orientation
Diagram,
T
op
View
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4-15
4-6.
Figures
Orientation
Diagram,
Bottom
View
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4-16
4-7. T
op and
Bottom Cover
Illustrated
P
arts
Breakdown
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4-18
4-8. Front
Panel
Illustrated P
arts Breakdown
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. 4-20
4-9.
Front
Frame and
Display/Keyboard Illustrated
P
arts
Breakdown
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4-22
4-10.
Front
Dress P
anel Illustrated
P
arts
Breakdown
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4-24
4-11.
T
op Side
Circuit Board
Illustrated
P
arts
Breakdown
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4-26
4-12.
F
an,
P
ower
Supply
,
and
Rear
P
anel
Connector
Illustrated
P
arts
Breakdown
.
.
4-28
4-13.
YIG,
Crystal
Oscillator
,
and
Sampler
Microcircuit
Illustrated
P
arts
Breakdown
.
4-30
4-14.
Attenuator
,
Bottom
Side
Circuit
Board,
and
Rails
Illustrated
P
arts
Breakdown
.
4-32
4-15.
Microwave
Output
and
SLPF
A
Illustrated
P
arts
Breakdown
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4-34
4-16.
Microwave
Deck
Illustrated
P
arts
Breakdown
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4-36
5-1.
Location
of
Major
Assemblies{T
op
View
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5-3
5-2.
Location
of
Major
Assemblies{Bottom
View
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5-4
5-3.
Cable
Locations{T
op
View
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5-5
5-4.
Cable
Locations{Bottom
View
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5-6
5-5.
T
op
or
Bottom
Cover
Removal
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5-12
5-6.
Service
P
osition{T
op
Cover
Removed
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5-14
5-7.
Service
P
osition{Bottom
Cover
Removed
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5-16
5-8.
P
ower
Supply
Cables
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. 5-18
5-9.
P
ower
Supply
Screws
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5-19
5-10.
Line
Fuse
Removal
and
Replacement
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5-20
5-11. F
an Cable Location
................
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5-21
5-12. F
an Assembly Removal .
.........................
. 5-22
5-13. Divider and Modulation Board Assembly Removal
..............
5-25
5-14. Microprocessor Board Assembly Cable Location
..
.............
5-27
5-15. Microprocessor Board Assembly Removal
...
...............
5-28
5-16. Microprocessor Board Battery Removal
....
.... .... .... ...
5-30
5-17. Crystal Oscillator Cables
...............
.... .... ...
5-31
5-18. Crystal Oscillator Removal
................
.... .... .
5-32
5-19. ALC Board Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-34
5-20. YIG Driver Board Service Position ..................... 5-35
5-21. YIG Driver Board Removal . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
5-22. YO Loop and Oset Synthesizer Board Removal .... .... .... ... 5-39
5-23. LO Synthesizer and Reference Board Service Position .... .... .... 5-41
5-24. LO Synthesizer and Reference Board Removal . . . . . . . . . . . . . . . . 5-43
5-25. Step Attenuator Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45
Contents-6

Agilent Technologies HP 83711B Specifications

General

Brand	Agilent Technologies
Model	HP 83711B
Category	Test Equipment
Language	English