3
CSD-XD55
Ver 1.1
• UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ............................................................ 6
3-2. Cabinet (Top) Assy ........................................................... 6
3-3. Cabinet (Front Assy), Cabinet (Bottom) Assy ................. 7
3-4. Wires ................................................................................ 8
3-5. MD Block ......................................................................... 9
3-6. Cassette Holder ................................................................ 9
3-7. Main Board ...................................................................... 10
3-8. Tuner Board...................................................................... 10
3-9. Power Board ..................................................................... 11
3-10. CD Lid.............................................................................. 11
3-11. CD Block Assy ................................................................. 12
3-12. Optical Pick-up ................................................................ 12
3-13. R/P Head (HRP301), TC Board ....................................... 13
3-14. Main Belt, RF Belt, Motor Assy (M301) ......................... 13
4. MECHANICAL ADJUSTMENTS......................... 14
5. ELECTRICAL ADJUSTMENTS .......................... 14
6. DIAGRAMS
6-1. IC Pin Description ............................................................ 17
6-2. Circuit Boards Location ................................................... 17
6-3. Block Diagram – CD Section – ........................................ 18
6-4. Block Diagram – Main Section – ..................................... 19
6-5. Printed Wiring Board – CD Section – .............................. 20
6-6. Schematic Diagram – CD Section –................................. 21
6-7. Printed Wiring Board
– Tuner Section(US, CND, E, SP model) – ..................... 22
6-8. Printed Wiring Board – Tuner Section (AEP model)– ..... 23
6-9. Schematic Diagram – Tuner Section – ............................. 24
6-10. Printed Wiring Boards – Main Section – ......................... 25
6-11. Schematic Diagram – Main Section (1/2) – ..................... 26
6-12. Schematic Diagram – Main Section (2/2) – ..................... 27
6-13. Printed Wiring Board – TC Section – .............................. 28
6-14. Schematic Diagram – TC Section – ................................. 29
6-15. Printed Wiring Boards – Control Section –...................... 30
6-16. Schematic Diagram – Control Section – .......................... 31
6-17. Printed Wiring Boards – Power Supply Section – ........... 32
6-18. Schematic Diagram – Power Supply Section –................ 33
6-19. IC Block Diagrams ........................................................... 34
7. EXPLODED VIEWS
7-1. Cabinet Section ................................................................ 37
7-2. Cabinet (Front) Section-1................................................. 38
7-3. Cabinet (Front) Section-2................................................. 39
7-4. Cabinet (Top) Section ...................................................... 40
7-5. Cabinet (Bottom) Section................................................. 41
7-6. Tape Mechanism Section ................................................. 42
7-7. CD Mechanism Section-1 ................................................ 43
8. ELECTRICAL PARTS LIST .................................. 44
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.