3
1-2 Specification
Spec Description
Design
∗ Micro ATX form factor 4 layers PCB size: 24.4x21.0cm
Chipset
∗ VIA K8M800 North Bridge Chipset
∗ VIA VT8237R Plus South Bridge Chipset
CPU Socket AM2
∗ Support 64bit AMD AM2 940-Pin package utilizes Flip-Chip
Pin Grid Array package compatible processor
∗ Support for HTT 1GHz AMD Athlon 64 X2 processor and
Athlon 64, and HTT 800MHz Sempron Processors
Memory Socket
∗ 240-pin DDRII Module socket x 2
∗ Support 2pcs DDRII 800/667/553 / 400 system memory
modules which are expandable to 2.0GB
Expansion Slot
∗ AGP slot x1 support AGP 2.0 & AGP 3.0 for 4X/8X mode
∗ 32-bit PCI slot x2
Integrate IDE and
Serial ATA RAID
∗ Two PCI IDE controllers support PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 33/66/100/133 functions that
deliver the data transfer rate up to 133 MB/s; Two Serial ATA
ports provide 150 MB/sec data transfer rate for two Serial ATA
Devices and offer RAID 0 and RAID 1 functions
VGA
∗ Integrated High Performance & High Quality 3D Accelerator
∗ Support Ultra-AGPII with 2GB/s bandwidth
∗ Built-in programmable 24-bit true-color RAMDAC up to
300MHz pixel clock
∗ Programmable frame buffer size from 16MB and up to 64MB.
LAN
∗ Integrated VIA 6103 10 /100 LAN PHY
∗ Supports Fast Ethernet LAN function provide 10Mb / 100Mb /
s data transfer rate
Audio
∗ VIA VT1617A AC’97 Digital Audio controller integrated
∗ 6-channel AC’97 Audio CODEC onboard
∗ Audio driver and utility included
BIOS
∗ Award 4MB Flash ROM
Multi I/O
∗ PS/2 keyboard and PS/2 mouse connectors
∗ Floppy disk drive connector x1
∗ Parallel port x1
∗ Serial port x1
∗ VGA port x1
∗ USB2.0 port x 4 and headers x 4 (connecting cable option)
∗ Audio connector (Line-in, Line-out, MIC)
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