ASROCK CML-HDV/M.2 TPM R2.0 - Specifications

English
2
1.2 Specications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 10
th
Gen Intel® Core
TM
Processors (Socket 1200)
•
5 Power Phase design
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® H370
Memory
•
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 2933/2800/2666/2400/2133 non-ECC, un-
buered memory
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
* Core
TM
(i9/i7) support DDR4 up to 2933; Core
TM
(i5/i3),
Pentium® and Celeron® support DDR4 up to 2666.
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
•
1 x PCI Express 3.0 x16 Slot
* Supports NVMe SSD as boot disks
•
1 x PCI Express 3.0 x1 Slot
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module
Graphics
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Supports Intel® UHD Graphics Built-in Visuals : Intel®
Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® UHD Graphics
•
DirectX 12