Asus P8H61-M LX3 PLUS R2.0 - Central Processing Unit (CPU); Installing the CPU

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P8H61-M LX3 R2.0 Series specications summary
(continued on the next page)
CPU LGA1155 socket for Intel
®
3rd/2nd Generation Core™ i7 / Core™
i5 / Core™ i3 / Pentium
®
/ Celeron
®
processors
Supports Intel 22nm CPU
Supports Intel
®
Turbo Boost Technology 2.0
* The Intel
®
Turbo Boost Technology 2.0 support depends on the
CPU types.
** Refer to www.asus.com for Intel
®
CPU support list.
Chipset Intel
®
H61 Express Chipset
Memory 2 x DIMMs, max. 16GB, DDR3 2200 (O.C.) / 2133 (O.C.) / 2000
(O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz, non-ECC, un-
buffered memory
Dual-channel memory architecture
* DDR3 1600 MHz and higher memory frequency is supported by
Intel
®
3rd generation processors.
** Refer to www.asus.com for the latest Memory QVL (Qualied
Vendors List).
*** When you install a total memory of 4GB capacity or more,
Windows
®
32-bit operating system may only recognize less than
3GB. We recommend a maximum of 3GB system memory if you
are using a Windows
®
32-bit operating system.
Expansion slots 1 x PCI Express 3.0*/2.0 x16 slot with latch
2 x PCI Express 2.0 x1 slots
* PCIe 3.0 speed is supported by Intel
®
3rd generation Core™
processors.
Graphics Supports D-Sub with max. resolution of 2048 x 1536 @75Hz
Max. UMA Memory: 1748MB
Storage
Intel
®
H61 Express Chipset:
- 4 x Serial ATA 3.0 Gb/s connectors
LAN
Realtek
®
8111F PCIe Gigabit LAN controller
Audio VIA
®
VT1708S 8-channel* High Denition Audio CODEC
- Supports Multi-Streaming
* Use a chassis with HD audio module in the front panel to
support an 8-channel audio output.
USB 10 x USB 2.0/1.1 ports (6 ports at the mid-board, 4 ports at the back
panel)
Other features 100% All High-quality Conductive Polymer Capacitors
(P8H61-M LX3 PLUS R2.0 only)