8. ApplypressurewithsolderingirontoFETallowingsolderpastetoheatup.FETshouldnowbefirmlyinplace.
9. SameagainforotherFET.
Applypressurehere.Confirmsolder
hasmeltedaroundinnercircleand
aroundedges.Thisneedstoreally
bedonewithalargetipironand
mediumtemperatefornolonger
than10seconds.