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Behringer iNuke NU3000 User Manual

Behringer iNuke NU3000
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Project: P0AHN
Model: NU3000
Materials: Soldering Iron, Solder Paste.
Components: 2 x T-IRGB-20B60PD1 (S.SKU Z74-53206-04503)
This rework must only be performed by a qualified technician.
To reduce the risk of death or injury be sure to observe all correct safety procedures.
1. WhenreplacingT1&T5fromMOSFETtoIGBTitissuggestedthatthefollowingcomponentsalsobecheckedand
replacedasneeded.D5,D12,R9,R10,R11,R17,R21,R25,T2,T3.
D5, D12 (DIODE;SCHOTTKY;SS0540;SOD123;SMD;ROHS) C10-18700-5408
R9, R25 (10k)
R10, R21 (10ohm)
R11, R17 (1k)
T2, T3 (TRANSISTOR;MMBT4403;SOT23;ROHS) J73-16440-36603
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Behringer iNuke NU3000 Specifications

General IconGeneral
Number of Channels2
ClassD
Total Harmonic Distortion (THD)< 0.5%
Signal-to-Noise Ratio> 100 dB
Damping Factor> 200
Input ConnectorsXLR, 1/4" TRS
Output ConnectorsBinding Posts, Speakon
Power Output (2 Ohms)1500 W per channel
Power Output (4 Ohms Bridged)3000 W
Frequency Response20 Hz - 20 kHz
Input Sensitivity0.775V
Input Impedance20 kOhms balanced
ControlsLevel
IndicatorsPower, Signal, Clip
CoolingFan-cooled
ProtectionShort circuit, thermal

Summary

Component Checks Before IGBT Swap

Diode D5, D12 Identification

Check and replace Schottky diodes D5, D12 (SS0540, SOD123, SMD, ROHS).

Resistors R9, R25 Specification

Check and replace resistors R9, R25, specified as 10k Ohm.

Resistors R10, R21 Specification

Check and replace resistors R10, R21, specified as 10 Ohm.

Resistors R11, R17 Specification

Check and replace resistors R11, R17, specified as 1k Ohm.

Transistors T2, T3 Identification

Check and replace transistors T2, T3 (MMBT4403, SOT23, ROHS).

Component Removal Procedure

Locate T1 & T5

Identify the FETs at positions T1 and T5 on the PCB.

Remove FETs and Heatsinks

Detach FETs and their associated heatsinks, noting the correct order of removal.

Clean Soldering Residue

Remove residual solder from the PCB after component removal.

IGBT FET Installation

Apply Solder Paste

Place solder paste on the PCB and the rear of the new IGBT FET.

Secure New FET

Position the new FET on the PCB and solder its feet securely.

Solder FET with Pressure

Apply pressure with soldering iron to heat solder paste, ensuring FET is firm.

Install Heatsinks

Place heatsinks back on the PCB with solder paste and solder into place.

Final Steps

Test and Assemble

Perform functional tests and reassemble the unit.

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