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Broce BW-260 - BROOM WAFERS; WAFER TYPES AND USES; DOWN PRESSURE FOR WIRE WAFERS; BRUSH WAFER LIFE EXTENSION

Broce BW-260
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22
MODEL BW-260
For parts and service, call:
(866) 283-2759
Waldon Equipment, LLC, 201 W. Oklahoma Ave., Fairview, OK 73737
BROOM WAFERS
Poly wafers are used in normal dry sweeping conditions: dirt, sand, leaves and other light debris.
These types of jobs will give the wafers their longest lift. Poly is recommended for most applications
due to their increased icking ability and is more economical to replace.
A combination of ½ poly and ½ wire wafer is not recommended except in conditions where ag-
gressive sweeping is needed. In most cases the standard all poly brush will be adequate. The wire
wafers will wear faster than the poly and cost much more to replace. Wire has sharp tips for cutting
action and can reach down into crack and crevasses better than poly. The sharp ends of the wire cut
through ice and snow faster than poly wafers. We recommend no more than a 2” down pressure pat-
tern to be used with wire wafers or a combination of poly and wire to prevent breakage of the bris-
tles. If too much down pressure is exerted on the bristles they will ex too much and break off close
to the wafer base, leaving the bristles on the pavement, Excessive down pressure reduces broom life
considerably.
The life span of brush wafers is directly related to the way they are used. When properly used the
brush wafer life can be extended by 50 to 100 hours.