Colnatec Eon - Page 24

• Materials
The material being applied during the deposition process. This entry turns
to “Custom” if the Density or Z-Factor is modied by the user, in order to
prevent mismatch.
• Density
The density of the selected material being applied.
• Z-Factor
Acoustic impedance factor which is used to compensate for dense
materials and is predened based on the selected material.
• Tooling [%]
The geometric relationship between the substrate and the positioning of
the sensor.
• Max Power [%]
Represents the maximum power level Eon™ will deliver to the source
[from 0%-100%], even when the heater requires more power to reach the
set-point temperature.
• Proportional
The proportional coefcient that controls the material deposition rate
during the PID phase.
• Integral
The integral time constant that controls the material deposition rate during
PID phase.
• Derivative
The derivative time constant that controls the material deposition rate
during the PID phase.
• Dwell Time
The time specied that follows the completion the predeposition process
before activation of the PID. This delay prevents the PID from engaging
the source power prematurely, giving the material a chance to reach
the sensor. (No material is applied to the sensor directly after the
predeposition process nishes, for the brief time it takes for the material to
initially transition from the source to the crystal in the event that a shutter is
present).
• Rise to Soak Time
The time specifying how long it takes Eon™ to raise source power from
0% to desired soak power
24
Chapter 3 Program Control
Layer Properties Dened
The following is a list of settings that denes the parameters of the deposition. All
settings must be set correctly for the software to function properly.