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Data Device Corporation
www.ddc-web.com
RDC-19220 SERIES
P-05/05-0
ORDERING INFORMATION
RDC-1922X_-XXXX (Ceramic Package)
Supplemental Process Requirements:
T = Tape and Reel (Not available in 40-pin DDIP package)
S = Pre-Cap Source Inspection
L = 100% Pull Test
Q = Pre-Cap Source and 100% Pull Test
K = One Lot Date Code
W = One Lot Date Code and Pre-Cap Source Inspection
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test
Blank = None of the Above
Accuracy:
2= 4 minutes + 1 LSB
3 = 2 minutes + 1 LSB
Process Requirements:
0 = Standard DDC Processing, without Burn-In
1 = MIL-PRF-38534 Compliant
2 = Standard DDC Processing, with Burn-In
3 = MIL-PRF-38534 Compliant, with PIND testing
4 = MIL-PRF-38534 Compliant, with Solder Dip
5 = MIL-PRF-38534 Compliant, with PIND testing, and Solder Dip
6 = Standard DDC Processing, with PIND testing, and Burn-In
7 = Standard DDC Processing, with Solder Dip, and Burn-In
9 = Standard DDC Processing, with Solder Dip, without Burn-In
Temperature Grade / Data Requirements:
1 = -55 to +125°C
4 = -55 to +125°C, with Variables Test Data
Package Options:
Blank = Standard
G = Lead free
Package:
0 = 40-Pin DDIP, (“+5 volt only” power supply feature - not available)
2 = 44-Pin J-Lead
External Component Selection Software (refer to General Setup
Conditions section) can be downloaded from DDC’s web site:
www.ddc-web.com.
TABLE 11015
(note 1)
, 1030
(note 2)
BURN-IN
Notes:
1. For Process Requirement "B*" (refer to ordering information), devices may be non-compliant with MIL-
STD-883, Test Method 1015, Paragraph 3.2. Contact factory for details.
2. When applicable.
3000g
2001CONSTANT ACCELERATION
C1010TEMPERATURE CYCLE
A and C1014
SEAL
—2009, 2010, 2017, and 2032INSPECTION
CONDITION(S)METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
FOR HYBRID AND MONOLITHIC HERMETIC PRODUCTS
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