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System features
Product comparison
The following table shows the comparison between the PowerEdge MX740c (designed for PowerEdge MX7000 chassis) and
PowerEdge M640/FC640 (designed for PowerEdge M1000e/VRTX and FX2/FX2S chassis) modular server:
Table 2. Comparison table
Feature PowerEdge MX740c PowerEdge M640/FC640
Processor
• One or two Intel® Xeon Scalable Processors
• Up to 28 cores per socket
• Max TDP: 205W
• One or two Intel® Xeon Scalable Processors
• Up to 28 cores per socket
• Max TDP: 165 W
Chipset
• Intel® C628
• Optional Intel® QuickAssist Technology (QAT)
• Intel® C621
Memory
• 24 DIMM slots
• 12 slots enabled for NVDIMM-N
• Maximum capacity (RDIMM): 768GB
• Maximum capacity (LRDIMM): 3TB
• Maximum capacity (NVDIMM-N): 192GB
• 16 DIMM sockets
• Maximum capacity (RDIMM): 512GB
• Maximum capacity (LRDIMM): 2TB
Storage Controllers
• S140 Software RAID
• HBA330 MX
• H730P MX Performance RAID, 2GB NV cache
• H745P MX Performance RAID, internal and
external drive connect, 8GB NV cache
• HBA330 MX mini-mezz, HBA, external drive
connect, no cache
• S140 Software RAID
• H330 Entry/Value RAID, no cache
• H730P Performance RAID, 2GB NV cache
Drive Support
• 2.5-inch 12Gb SAS
• 2.5-inch 6Gb SATA
• 2.5-inch NVMe
• 2.5-inch 12Gb SAS
• 2.5-inch 6Gb SATA
• 2.5-inch NVMe
Drive Backplanes
• 6 x 2.5-inch SAS/SATA
• 6 x 2.5-inch SAS/SATA/NVMe
• 4 x 2.5-inch SAS/SATA/NVMe for NVDIMM
implementations
• 2 x 2.5-inch SAS/SATA/NVMe
Internal Boot Choice of BOSS (Boot Optimized Storage
Subsystem) or IDSDM (Internal Dual SD Module)
Choice of BOSS (Boot Optimized Storage
Subsystem) or IDSDM (Internal Dual SD Module)
I/O Slots
• Two PCIe 3.0 x16 Mezz slots (Fabric A and B)
• One PCIe 3.0 x16 Mini-mezz slot (Fabric C)
• One bNDC (Ethernet)
• Two PCIe 3.0 x8 Mezz slots (M1000e)
• Two PCIe 2.0 x8 switch mezz (VRTX)
• PCIe adapter for FX2S enablement (FX2)
USB
• One internal USB 3.0 port
• One external USB 3.0 port
• One internal USB 3.0 port
• One external USB 3.0 port
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