Ebyte E22-900M30S - Page 11

ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
® Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
® Please ensure the humidity is within limited range for some parts are sensitive to humidity.
® Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
® There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
® The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long.
® Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
® Ifthe extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature Curve feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 S1n96.5/Ag3/Cu0.5
) ) Minimum preheating
Preheat Temperature min (Tsmin) 100C° 150C°
temperature
Maximum preheating
Preheat temperature max (Tsmax) 150¢C° 200¢°
temperature
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rising rate
3C°/second max 3C°/second max
Liquidous Temperature (TL) Liquid phase temperature 183C° 217¢C°
Time (tL) Maintained Above (TL) Time above liquidus 60-90 sec 30-90 sec
Peak temperature (Tp) Peak temperature 220-235C° 230-250C°
Aveage ramp-down rate (Tp to Tsmax) Average descent rate
6C°/second max 6C°/second max
Time 25°C to peak temperature
Time of 25 © C to peak
temperature
6 minutes max 8 minutes max
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