Ebyte E52-400/900NW22S - XII. Welding Operation Guidance; 12.1 Reflow temperature; 12.2 Reflow soldering curve

Chengdu Ebyte Electronic Technology Co.,Ltd.. E52-400/900NW22S User Manual
CopyriCopyright ©2012–2023, Chengdu Ebyte Electronic Technology Co.,Ltd.
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Ⅻ. Welding Operation Guidance
12.1 Reflow temperature
Reflow soldering curve characteristics
Assembly with lead process
Lead free process assembly
Preheating/insulation
Minimum temperature
(Tsmin)
100℃
150℃
Maximum temperature
(Tsmax)
150℃
200℃
Time (Tsmin~Tsmin)
60-120 seconds
60-120 seconds
Heating slope (TL~Tp)
3 ℃/s, maximum
3 ℃/s, maximum
Liquid phase temperature (TL)
183℃
217℃
Holding time above TL
60-90 seconds
60~90seconds
Package peak temperature Tp
Users cannot exceed the
temperature indicated on the
"Moisture Sensitivity" label.
Users cannot exceed the
temperature indicated on the
"Moisture Sensitivity" label of
the product.
Time (Tp) within 5 ℃ of the specified grading
temperature (Tc), as shown in the following figure
20 seconds
30 seconds
Cooling slope (Tp~TL)
6℃/seconds，maximum
6℃/seconds，maximum
Time from room temperature to peak temperature
6 minutes, maximum
8 minutes, maximum
※The peak temperature (Tp) tolerance of the temperature curve is defined as the user's upper limit
12.2 Reflow soldering curve