Table 8-12: Process Connection Temperature
Temperature class Process connection
temperature
Ambient temperature
T6 -60 °C to +70 °C -60 °C to +70 °C
T5 -60 °C to +80 °C -60 °C to +80 °C
T4 -60 °C to +120 °C -60 °C to +80 °C
Special Conditions for Safe Use (X):
1. This device contains a thin wall diaphragm less than 1mm thickness
that forms a boundary between zone 0 (process connection) and
zone 1 (all other parts of the equipment). The model code and
datasheet are to be consulted for details of the diaphragm material.
Installations, maintenance and use shall take into account the
environmental conditions to which the diaphragm will be subjected.
The manufacturer's instructions for installation and maintenance
shall be followed in detail to assure safety during its expected
lifetime.
2. Flameproof joints are not intended for repair.
3. Non-standard paint options may cause risk from electrostatic
discharge. Avoid installations that could cause electrostatic build-up
on painted surfaces, and only clean the painted surfaces with a damp
cloth. If paint Is ordered through a special option code, contact the
manufacturer for more information.
I2 Brazil Intrinsic Safety
Certificate:
UL-BR 13.0246X
Standards:
ABNT NBR IEC60079-0:2008 + Errata 1:2011, ABNT NBR
IEC60079-11:2009
Markings:
Ex ia IIC T4 Ga (–55 °C ≤ T
a
≤ +70 °C)
Parameter HART
Voltage U
i
30 V
Current I
i
200 mA
Power P
i
0.9 W
Capacitance C
i
0.012 µF
Quick Start Guide March 2022
38 Emerson.com/Rosemount
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