1-4 Overview
S
ystem
Activities
Figure 1–3 identifies activities that are needed to use the system effectively. The activities are
grouped under four major functions.
Remove and Replace
GR228X
Test System
Set Up System
Develop Test Programs
Production Testing
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Prepare Site
Install Hardware
Load Software
Create User Accounts
SetĆup System
Use Window NT
Choose an Editor
Identify Test Program
Build, Test, and Debug
Debug Test Program
Perform UUT Testing
Routine Maintenance
Perform Preventative
Calibrate Instruments
If Test System fails,
Customize Environment
Development Process
Release Test Program
Maintenance
Run Diagnostic
Defective System Parts
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Develop Test Program
Test Fixture
and Service
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Collect and Analyze
Test Data
and Fixtures
SelfĆTests
System Management
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SetĆup Network
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Run Verification
Programs
Maintenance
for Production Testing
31953.1
Operating System
Figure 1–3 GR228X Test System Activities
T
esting
Methods
There are two testing methods available for the GR228X systems; in-circuit and functional. Both
methods can produce tests that identify a high percentage of all possible defects. Depending on the
assembly stage, either the in-circuit or the functional testing method is easier to implement and
provides the most useful information.
In-circuit tests are usually performed at earlier and intermediate stages of assembly when it is most
important to identify and correct component faults. While the in-circuit test does not provide direct
information about how well a board functions, experience shows that most boards that pass an
in-circuit test can also pass a thorough functional test. Therefore, even though the in-circuit test
does not determine whether the whole board works correctly, it can indicate whether a board
should continue through assembly or whether it has faults that need repair.
Once it is established that all components are correctly inserted and are operational, board–level
functional tests or quality control tests can be useful for verifying a board’s overall performance.
Functional tests are usually performed in the later stages of assembly when access is only available
at the board edge.