GOWIN GW2A-55 - User Manual

GW2A series of FPGA Products
Package & Pinout User Guide
UG111-1.8E, 12/27/2021

Summary

2 Overview

2.2 Package and Max. I;O Information

Presents package types, dimensions, and maximum I/O counts for GW2A-18 and GW2A-55.

2.4 Pin Quantity

Details pin quantities for GW2A-18 and GW2A-55 across various package types.

2.5 Pin Definitions

Defines user I/O, multi-function, and dedicated pins in the GW2A series.

2.6 Introduction to the I;O BANK

3 View of Pin Distribution

3.1 View of GW2 A-18 Pins Distribution

Provides pin distribution diagrams for GW2A-18 across various packages.

3.2 View of GW2 A-55 Pin Distribution

Provides pin distribution diagrams for GW2A-55 across various packages.

4 Package Diagrams

4.1 QN88 Package Outline (10 mm x 10 mm)

Provides dimensional drawing and specifications for the QN88 package.

4.2 LQ144 Package Outline (20 mm x 20 mm)

Provides dimensional drawing and specifications for the LQ144 package.

4.3 EQ144 Package Outline (20 mm x 20 mm)

Provides dimensional drawing and specifications for the EQ144 package.

4.4 MG196 Package Outline (8 mm x 8 mm)

Provides dimensional drawing and specifications for the MG196 package.

4.5 PG256 Package Outline (17 mm x 17 mm)

4.6 PG256 C; PG256 CF Package Outline (17 mm x 17 mm)

4.7 PG256 S; PG256 SF Package Outline (17 mm x 17 mm)

4.8 PG256 E Package Outline (17 mm x 17 mm)

4.9 PG484 Package Outline (23 mm x 23 mm, GW2 A-18)

4.10 PG484 Package Outline (23 mm x 23 mm, GW2 A-55)

4.11 PG1156 Package Outline (35 mm x 35 mm)

4.12 UG324;UG324 D;UG324 F Package Outline (15 mm x 15 mm)

4.13 UG484 Package Outline (19 mm x 19 mm)

4.14 UG676 Package Outline (21 mm x 21 mm)

GOWIN GW2A-55 Specifications

General

Family	Arora
Logic Cells/Elements	55K
Max I/O Pins/User I/O	400
DSP Blocks	144
Process Technology	55 nm
Operating Voltage	1.2V
Package Type	QFN, BGA
Category	FPGA
Operating Temperature	-40°C to 100°C
Arora Family	Arora