EasyManua.ls Logo

HP 22f

HP 22f
9 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
Loading...
EL-MF877-00 Page 1
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 22f Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
None
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
None
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
None
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
None
Capacitors / condensers (Containing PCB/PCT)
None
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
None
External electrical cables and cords
DC Cable for External Power Supply
4
Gas Discharge Lamps
None
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
None
Question and Answer IconNeed help?

Do you have a question about the HP 22f and is the answer not in the manual?

HP 22f Specifications

General IconGeneral
BrandHP
Model22f
CategoryMonitor
LanguageEnglish

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Components requiring selective treatment with a surface greater than 10 sq cm.

Batteries, excluding Li-Ion batteries

All types including standard alkaline, coin or button style batteries.

Li-Ion batteries

Includes all Li-Ion batteries attached by screws, snaps, or adhesive.

Mercury-containing components

Components containing mercury, e.g., in lamps or display backlights.

Liquid Crystal Displays (LCD)

LCDs with a surface greater than 100 sq cm, including gas discharge lamps.

Cathode Ray Tubes (CRT)

Components identified as Cathode Ray Tubes.

Capacitors condensers (Containing PCBPCT)

Capacitors or condensers that contain PCB or PCT.

Electrolytic Capacitors Condensers

Electrolytic capacitors or condensers measuring > 2.5 cm in diameter or height.

External electrical cables and cords

Electrical cables and cords external to the main product.

Gas Discharge Lamps

Lamps that operate using gas discharge.

Plastics containing Brominated Flame Retardants

Plastics weighing > 25 grams containing Brominated Flame Retardants.

Components and parts containing toner and ink

Parts containing toner, ink, liquids, semi-liquids, or paste.

Components and waste containing asbestos

Parts or waste materials identified as containing asbestos.

Components, parts and materials containing refractory ceramic fibers

Materials containing refractory ceramic fibers.

Components, parts and materials containing radioactive substances

Materials containing radioactive substances.

Tools Required

Plastic shovel

A plastic shovel tool for disassembly.

Screwdriver

A screwdriver for removing screws.

Product Disassembly Process

Step 1: Remove Rear Cover Assembly

Remove screws from the rear cover and separate the assembly.

Step 2: Remove Connectors

Disconnect FCC cable and display key board cable connectors.

Step 3: Remove Shielding and Main Board

Remove screws from shielding and main board, then separate the main board.

Step 4: Strip Screws

Remove screws securing components on the main board and other parts.

Step 5: Release Materials

Release all materials, handling ESD-sensitive parts appropriately.

Related product manuals