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HP 250 G1 - Page 97

HP 250 G1
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer model
equipped with an Intel processor.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
Reverse this procedure to reassemble and install the fan/heat sink assembly.
ENWW Component replacement procedures 89

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