EL-MF877-00
Template Revision C
Page 3
Last revalidation date 08-May-2020
HPI instructions for this template are available at EL-MF877-01
Tool Description
Tool Size (if
applicable)
Electric Iron QUICK 310
Crisscross Screw Driver PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove access panel (Step1-2)
2. Disconnect ODD/ HDD cable and remove ODD/ HDD (Step3~Step11)
3. Remove all cables and cooler from MB(step12-16)
4. Remove Memory/CPU/GFX/WLAN/Batteryfrom MB(step17~23)
5. Remove antenna from chassis (step24
6. Remove MB from chassis(Step25~26)
7. Remove PSU from chassis(step27~29)
8. Separate PSU and remove the Electrolytic Capacitors（step30~33）
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying location
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