HP Z2 SFF G5 User Manual

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 SFF G5 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact
.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
Acbel 260W EPA92 PSU
1
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

HP Z2 SFF G5 Specifications

General

SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
SSD memory type	TLC
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	256 GB
Compatible memory cards	SD
Number of SSDs installed	1
Chassis type	SFF
Product color	Black
Product type	Workstation
Market positioning	Business
Operating system installed	Windows 10 Pro for Workstations
Operating system architecture	64-bit
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC8
Discrete graphics card model	NVIDIA® Quadro® P620
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR5
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
HP Management tools	HP PC Hardware Diagnostics UEFI; HP Performance Advisor; HP Support Assistant; HP PC Hardware Diagnostics Windows; ZCentral Remote Boost; HP Image Assistant; HP Manageability Integration Kit
Wi-Fi	-
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DisplayPort version	1.4
USB 2.0 ports quantity	2
Thunderbolt 3 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	4
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	3200 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tjunction	100 °C
Processor cache	12 MB
Processor cores	6
Processor model	i5-10500
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1200 (Socket H5)
Processor threads	12
Processor codename	Comet Lake
Processor frequency	3.1 GHz
Processor cache type	L3
Processor lithography	14 nm
PCI Express slots version	3.0
Processor boost frequency	4.5 GHz
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
Scalability	1S
Processor ARK ID	199277
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Thermal solution specification	PCG 2015C
Graphics card interface	PCIe x16

Weight and Dimensions

Depth	308 mm
Width	338 mm
Height	100 mm
Weight	5400 g

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Assemblies (PCA)

Components requiring selective treatment with surface greater than 10 sq cm.

Batteries

Excludes Li-Ion batteries; includes alkaline, coin, or button style.

Li-Ion Batteries

Includes all Li-Ion batteries, attached by screws, snaps, or adhesive.

Mercury-Containing Components

Includes mercury in lamps and display backlights.

Tools Required for Disassembly

Product Disassembly Process

Basic Disassembly Steps

Steps for removing components and external enclosure for selective treatment.

Optional Graphic Illustrations

Graphic illustrations for identifying components requiring selective treatment.