HP Z2 Mini G5 User Manual

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 Mini G5 Workstation
TPC-I046-DM-180
TPC-I046-DM-280
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact
.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
6
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[0 ] screws
[0 ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps (15.6”)
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0

HP Z2 Mini G5 Specifications

General

Tjunction	100 °C
Processor cache	16 MB
Processor cores	8
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor socket	LGA 1200 (Socket H5)
Processor threads	16
Processor codename	Comet Lake
Processor frequency	2.9 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.8 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory bandwidth supported by processor (max)	45.8 GB/s
Maximum internal memory supported by processor	128 GB
Chassis type	Mini PC
Product color	Black
Country of origin	China
Intel® vPro™ Platform Eligibility	-
ECC	No
Memory slots	2x DIMM
Internal memory	16 GB
Memory clock speed	3200 MHz
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD memory type	TLC
Total storage capacity	512 GB
Product type	Workstation
Motherboard chipset	Intel W480
HP segment	Business
HP Security tools	HP Secure Erase; HP Sure Click; HP Sure Sense; HP Sure Start Gen6; HP Sure Run Gen3; HP Sure Recover Gen3; HP BIOSphere Gen6; HP Sure Admin; Hood Sensor Optional Kit; HP Client Security Manager Gen6
HP Software provided	HP PC Hardware Diagnostics UEFI; HP Performance Advisor; HP PC Hardware Diagnostics Windows; HP Image Assistant; HP Manageability Integration Kit
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DisplayPorts quantity	3
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity	2
Operating system installed	Windows 10 Pro for Workstations
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC5
Discrete graphics card model	NVIDIA Quadro T1000
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	4 GB
Discrete graphics memory type	GDDR5
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1200 MHz
Power supply	280 W
Scalability	1S
Processor ARK ID	199316
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Thermal solution specification	PCG 2015C
Graphics card interface	PCIe x16
Harmonized System (HS) code	84715000

Weight and Dimensions

Width	216 mm
Height	58 mm
Weight	2100 g

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

PCBs/PCAs with surface area > 10 sq cm.

Li-Ion batteries

All Li-Ion batteries, including detachable ones.

Mercury-containing components

Components containing mercury, e.g., lamps.

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Backlit displays with gas discharge lamps.

Plastics containing Brominated Flame Retardants

Plastics > 25g, excluding PCBs/PCAs.

Components and waste containing asbestos

Asbestos-containing parts.

Tools Required

Screw driver (T8)

Phillips head screwdriver, size T8.

Screw driver (T10)

Phillips head screwdriver, size T10.

Screw driver (T15)

Phillips head screwdriver, size T15.

Disassembly Procedures

Disassemble top cover

Steps to remove the top cover.

Disassemble HDD

Steps to remove the HDD.

Disassemble CPU fan, GPU fan

Steps to remove CPU/GPU fan.

Disassemble CPU/GPU thermal

Steps to remove CPU/GPU thermal module.

Disassemble M/B battery

Steps to remove M/B battery.