HP Z2 Mini G5 User Manual

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T8
Screw driver
T10
Screw driver
T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Follow steps described in Disassembly instruction (file attached)
2. If parts can be removed without using a tool, remove it first
3. Use correct screwdriver and torque value before unlock the screw
4.
5.
6.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).

HP Z2 Mini G5 Specifications

General

Tjunction	100 °C
Processor cache	16 MB
Processor cores	8
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor socket	LGA 1200 (Socket H5)
Processor threads	16
Processor codename	Comet Lake
Processor frequency	2.9 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.8 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory bandwidth supported by processor (max)	45.8 GB/s
Maximum internal memory supported by processor	128 GB
Chassis type	Mini PC
Product color	Black
Country of origin	China
Intel® vPro™ Platform Eligibility	-
ECC	No
Memory slots	2x DIMM
Internal memory	16 GB
Memory clock speed	3200 MHz
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD memory type	TLC
Total storage capacity	512 GB
Product type	Workstation
Motherboard chipset	Intel W480
HP segment	Business
HP Security tools	HP Secure Erase; HP Sure Click; HP Sure Sense; HP Sure Start Gen6; HP Sure Run Gen3; HP Sure Recover Gen3; HP BIOSphere Gen6; HP Sure Admin; Hood Sensor Optional Kit; HP Client Security Manager Gen6
HP Software provided	HP PC Hardware Diagnostics UEFI; HP Performance Advisor; HP PC Hardware Diagnostics Windows; HP Image Assistant; HP Manageability Integration Kit
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DisplayPorts quantity	3
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity	2
Operating system installed	Windows 10 Pro for Workstations
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC5
Discrete graphics card model	NVIDIA Quadro T1000
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	4 GB
Discrete graphics memory type	GDDR5
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1200 MHz
Power supply	280 W
Scalability	1S
Processor ARK ID	199316
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Thermal solution specification	PCG 2015C
Graphics card interface	PCIe x16
Harmonized System (HS) code	84715000

Weight and Dimensions

Width	216 mm
Height	58 mm
Weight	2100 g