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HP 290 G1 PCI Microtower Business

HP 290 G1 PCI Microtower Business
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EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 290 G1 PCI Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA, PSU
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries PCA
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
1
External electrical cables and cords
AC Power Cable
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
System Fan
1
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
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HP 290 G1 PCI Microtower Business Specifications

General IconGeneral
Memory4 GB DDR4-2400 SDRAM (1 x 4 GB)
Product TypeDesktop
Storage500 GB 7200 rpm SATA
Operating SystemWindows 10 Pro
GraphicsIntel HD Graphics 630
AudioHD Audio with Realtek ALC221 codec
PortsUSB 3.1, USB 2.0, HDMI, VGA, Ethernet
Expansion Slots1 PCIe x16, 1 PCIe x1
Power Supply180 W
Optical DriveDVD-Writer
ChipsetIntel
Weight12.5 lb (5.67 kg)

Summary

Items Requiring Selective Treatment

Tools Required

Product Disassembly Process

Remove Access Panel

Step 1: Loosen thumb screw and remove access panel from the chassis.

Disconnect ODDHDD Cables

Steps 2-3: Disconnect power and SATA cables from ODD and HDD.

Remove ODDHDD from Chassis

Steps 4-7: Remove the ODD/HDD assembly from the chassis.

Remove Cables and Heat Sink

Steps 8-11: Disconnect all cables and remove the heat sink from the motherboard.

Remove Memory, CPU, Battery

Steps 12-14: Remove memory modules, CPU, and battery from motherboard.

Remove Front Panel

Step 15: Remove the front panel assembly from the chassis.

Remove Motherboard from Chassis

Step 16: Use T-15 screwdriver to remove motherboard from chassis.

Remove System Fan

Step 17: Use PH1 screwdriver to loosen and remove the system fan.

Remove PSU from Chassis

Steps 17-19: Loosen PSU screws and press latch to remove from chassis.

Separate PSU and Remove Capacitors

Steps 20-23: Open PSU cage, remove PCB and use electric iron for capacitors.

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