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HP 350 G2 User Manual

HP 350 G2
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
26 Chapter 4 Removal and replacement preliminary requirements

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HP 350 G2 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Silver
Country of originChina
Bus typeDMI2
SteppingD0
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli3-4030U
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel® Core™ i3-4000 Mobile Series
Processor socketBGA 1168
Processor threads4
Processor codenameHaswell
Processor frequency1.9 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations4x1, 2x4
Thermal Design Power (TDP)15 W
Maximum number of PCI Express lanes12
Motherboard chipset-
Internal memory4 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 4 GB
HDD speed5400 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity500 GB
Number of HDDs installed1
Display diagonal15.6 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
On-board graphics card ID0xA16
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory2 GB
On-board graphics card base frequency200 MHz
On-board graphics card dynamic frequency (max)1000 MHz
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Audio systemDTS Sound+
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 4 (802.11n)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
DisplayPorts quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Operating system installedFreeDOS
Processor codeSR1EN
Processor ARK ID81018
Intel TSX-NI version0.00
Processor package size40 x 24 x 1.5 mm
Intel ME Firmware Version9.5
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology version1.00
Battery capacity41 Wh
Battery life (max)- h
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth264 mm
Width384 mm
Height23.1 mm
Weight2300 g

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