HP 430 - Page 95

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
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A thermal pad is used on the FCH chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.
Component replacement procedures
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