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HP Compaq 6000 Pro Quickspecs

HP Compaq 6000 Pro
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Environmental
Operating temperature
32° to 131°F (0° to 55° C)
Operating humidity
131° F (55° C) with 5% to 95% non-condensing
humidity
Dimensions
2.75 in x 4.13 in (7 cm x 10.5 cm), low profile compatible
Management capabilities
ACPI, WOL and DMI 2.0, PXE 2.0, WfM 2.0, Broadcom mgmt utility, ASF2.0,
DASH 1.0 and DASH 1.1 profiles
HP 802.11b/g/n Wireless
PCIe x1 Card
Dimensions (L x H)
3.3 x 4.7 inches (8.5 x 12 cm)
Weight
0.08 pounds (40 g)
Controller
Ralink RT2790
System interface
PCIExpress x1
Network standard
802.11 b/g/n
Frequency band
2.400 - 2.497 GHz
Operating temperature
14° to 149°F, operating (-10° to 65°C, operating)
Storage temperature
-40° to 176°F, non-operating (-40° to 80°C, non-operating)
Humidity
10-90% operating
5-95% non-operating
Operating voltage
3.3V +/- 9%
12V +/- 8%
Power consumption
Platform/WLAN Mode
Power Consumption
Maximum Power
Consumption
10 Watts
Transmit Only
4 Watts maximum averaged power over 1 second
Transmit Packet or Active
Scanning
1000 mA peak current for 100 microseconds or
longer
Receive Only Mode or Idle
without IEEE PSP mode
enabled
3 Watts maximum averaged over 1 second
Idle, with IEEE PSP mode
enabled
1.0 Watts maximum averaged over 1 second
Transmit Disabled (turned
off in software)
50 mW maximum, averaged over 1 second
Platform in S3 or S4
(power removed from Low
Profile PCI Express Card)
5 mW maximum, averaged over 1 second
Output power
(approximately)
802.11b modes
802.11g modes
EWC modes
+19 dBm +/- 1.0 dB
maximum
+17 dBm +/- 1.0 dB
maximum
+17 dBm +/- 1.0 dB
maximum (total
power in all transmit
chains)
Receive sensitivity
Mode
Data rate
Sensitivity
802.11b
1 Mbps
-94 dBm
802.11b
11 Mbps
-85 dBm
QuickSpecs
HP Compaq 6000 Pro Business PC
Technical Specifications - Communications
DA - 13411 North America — Version 24 — October 19, 2011
Page 25

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HP Compaq 6000 Pro Specifications

General IconGeneral
Tcase72.4 °C
Bus typeFSB
SteppingC0
Processor cache6 MB
Processor cores2
Processor modelE8500
Processor familyIntel® Core™2 Duo
Processor seriesIntel Core 2 Duo E8000 Series
Processor socketLGA 775 (Socket T)
Processor codenameWolfdale
Processing Die size107 mm²
Processor frequency3.16 GHz
Processor cache typeL2
Processor lithography45 nm
Processor system typeDP
Processor manufacturerIntel
Processor front side bus1333 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)65 W
Processor core voltage (AC)0.850/1.3625 V
Number of processors installed1
CPU multiplier (bus/core ratio)9.5
Number of Processing Die Transistors410 M
PlatformPC
LightScribeYes
Power supply typeAC/DC
Security featuresTPM 1.2
External drive bays2 x 5.25\
Internal drive bays2 x 3.5\
Networking featuresGigabit Ethernet
Compliance industry standardsIEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Audio systemRealtek ALC261
Motherboard chipsetIntel® Q43
Audio output channels2.0 channels
Memory slots4x DIMM
Internal memory4 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)2 x 2 GB
HDD size3.5 \
HDD speed7200 RPM
HDD interfaceSATA
Optical drive typeDVD-RW
Total storage capacity500 GB
Discrete graphics card modelNot available
On-board graphics card modelIntel® GMA 4500
On-board graphics card familyIntel® GMA
Operating system installedWindows 7 Professional
USB 2.0 ports quantity10
Firewire (IEEE 1394) ports0
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Cable lock slot typeKensington
Number of 3.5\" bays3
Power supply320 W
Processor codeSLAPK
Processor ARK ID33911
Processor package size37.5 x 37.5 mm
Weight and Dimensions IconWeight and Dimensions
Depth430 mm
Width176 mm
Height377 mm
Weight9300 g

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