HP EliteBook 8540P Maintenance And Service Guide

Bottom components
Component Description
(1) SIM slot Contains a wireless subscriber identity module (SIM) (select
models only). The SIM slot is located inside the battery bay.
(2) Battery bay Holds the battery.
(3) Docking connector Connects an optional docking device.
(4) Vents (6) Enable airflow to cool internal components.
NOTE: The computer fan starts up automatically to cool internal
components and prevent overheating. It is normal for the internal
fan to cycle on and off during routine operation.
(5) Accessory battery connector Connects an optional accessory battery.
(6) Memory module compartment Contains two expansion memory module slots.
(7) Hard drive bay Holds the hard drive.
(8) Bluetooth compartment Contains a Bluetooth device.
(9) Wireless module compartment Contains an HP Mobile Broadband Module.
NOTE: To prevent an unresponsive system, replace the
wireless module only with a wireless module authorized for use in
the computer by the governmental agency that regulates wireless
devices in your country or region. If you replace the module and
then receive a warning message, remove the module to restore
computer functionality, and then contact technical support
through Help and Support.
(10) Battery release latch Releases the battery from the battery bay.
Bottom components 19

HP EliteBook 8540P Specifications

General

Bus type	DMI
Stepping	K0
Tjunction	105 °C
Processor cache	4 MB
Processor cores	2
Processor model	i7-640M
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-600 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.8 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
PCI Express slots version	2.0
Processor boost frequency	3.46 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	21
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® QM57 Express
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	-
Card reader integrated	Yes
Total storage capacity	320 GB
Number of HDDs installed	1
Display diagonal	15.6 \
Display resolution	1600 x 900 pixels
Native aspect ratio	16:9
Modem speed	56 Kbit/s
Power supply type	AC/DC
Intel segment tagging	Enterprise
Compliance industry standards	IEEE802.3, IEEE802.3u, IEEE802.3ab
Internal memory	4 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Pointing device	Touchpad
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
CardBus PCMCIA slots quantity	0
AC adapter power	90 W
Battery capacity	73 Wh
Number of battery cells	8
Product color	Black, Silver
Country of origin	China
Processor code	SLBTN
Processor ARK ID	49666
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Depth	252 mm
Width	374 mm
Height	32 mm
Weight	2950 g