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HP EliteBook 8540P Maintenance And Service Guide

HP EliteBook 8540P
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Cables and connectors
CAUTION: When servicing the computer, be sure that cables are placed in their proper locations
during the reassembly process. Improper cable placement can damage the computer.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to
unseat or seat the cables during removal and insertion. Handle cables by the connector whenever
possible. In all cases, avoid bending, twisting, or tearing cables. Be sure that cables are routed in
such a way that they cannot be caught or snagged by parts being removed or replaced. Handle flex
cables with extreme care; these cables tear easily.
Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to
the computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the
computer is off or in Hibernation, turn the computer on, and then shut it down through the operating
system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive,
avoid touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and
be sure that the optical drive tray is closed.
Handle drives on surfaces covered with at least 2.5 cm (one inch) of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing a hard drive to products that have magnetic fields, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Preliminary replacement requirements 41

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HP EliteBook 8540P Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache4 MB
Processor cores2
Processor modeli7-640M
System bus rate2.5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-600 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.8 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
PCI Express slots version2.0
Processor boost frequency3.46 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)21
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® QM57 Express
HDD speed7200 RPM
HDD interfaceSATA
Optical drive type-
Card reader integratedYes
Total storage capacity320 GB
Number of HDDs installed1
Display diagonal15.6 \
Display resolution1600 x 900 pixels
Native aspect ratio16:9
Modem speed56 Kbit/s
Power supply typeAC/DC
Intel segment taggingEnterprise
Compliance industry standardsIEEE802.3, IEEE802.3u, IEEE802.3ab
Internal memory4 GB
Memory clock speed1333 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
Pointing deviceTouchpad
Wi-Fi standards802.11a, 802.11b, 802.11g
Bluetooth version2.1+EDR
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit Ethernet
Operating system installedWindows 7 Professional
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
CardBus PCMCIA slots quantity0
AC adapter power90 W
Battery capacity73 Wh
Number of battery cells8
Product colorBlack, Silver
Country of originChina
Processor codeSLBTN
Processor ARK ID49666
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1/4.2
Intel® Turbo Boost Technology1.0
Physical Address Extension (PAE)36 bit
Weight and Dimensions IconWeight and Dimensions
Depth252 mm
Width374 mm
Height32 mm
Weight2950 g

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