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HP EliteBook 8540P Maintenance And Service Guide

HP EliteBook 8540P
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, and then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines
described in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
42 Chapter 4 Removal and replacement procedures

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HP EliteBook 8540P Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache4 MB
Processor cores2
Processor modeli7-640M
System bus rate2.5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-600 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.8 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
PCI Express slots version2.0
Processor boost frequency3.46 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)21
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® QM57 Express
HDD speed7200 RPM
HDD interfaceSATA
Optical drive type-
Card reader integratedYes
Total storage capacity320 GB
Number of HDDs installed1
Display diagonal15.6 \
Display resolution1600 x 900 pixels
Native aspect ratio16:9
Modem speed56 Kbit/s
Power supply typeAC/DC
Intel segment taggingEnterprise
Compliance industry standardsIEEE802.3, IEEE802.3u, IEEE802.3ab
Internal memory4 GB
Memory clock speed1333 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
Pointing deviceTouchpad
Wi-Fi standards802.11a, 802.11b, 802.11g
Bluetooth version2.1+EDR
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit Ethernet
Operating system installedWindows 7 Professional
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
CardBus PCMCIA slots quantity0
AC adapter power90 W
Battery capacity73 Wh
Number of battery cells8
Product colorBlack, Silver
Country of originChina
Processor codeSLBTN
Processor ARK ID49666
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1/4.2
Intel® Turbo Boost Technology1.0
Physical Address Extension (PAE)36 bit
Weight and Dimensions IconWeight and Dimensions
Depth252 mm
Width374 mm
Height32 mm
Weight2950 g

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