EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel
2. Remove HDD and HDD FAN for Dolomite and Hood Sensor
3. Remove system fan
4. Remove heat sink from M/B
5. Remove WLAN Card from M/B
6. Remove ambient sensor fly cable and Speaker cable
7. Remove M/B and battery
8. Remove Memory
9. Remove Rear IO (HDMI/DP/SERIAL) card and M.2 card
10. Remove front bezel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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