HP EliteDesk 800 G4 User Manual

EL-MF877-00
Template Revision B
Page 1
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G4 SFF
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Chicony 250W EPA92 HV :C1
1
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent
0
1.0 Items Requiring Selective Treatment

HP EliteDesk 800 G4 Specifications

General

Bus type	DMI3
Tjunction	100 °C
Processor cache	12 MB
Processor cores	6
Processor model	i7-8700K
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-8700 Desktop Series
Processor threads	12
Processor codename	Coffee Lake
Processor frequency	3.7 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.7 GHz
PCI Express configurations	1x16, 1x8+2x4, 2x8
Thermal Design Power (TDP)	95 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	64 GB
Memory slots	4x DIMM
Internal memory	16 GB
Maximum internal memory	- GB
Memory layout (slots x size)	2 x 8 GB
NVMe	Yes
HDD speed	7200 RPM
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
HDD interface	SATA
SSD interface	NVMe, PCI Express
Storage media	HDD+SSD
Optical drive type	DVD-RW
Total HDDs capacity	500 GB
Total SSDs capacity	256 GB
Card reader integrated	No
Total storage capacity	756 GB
Number of execution units	24
On-board graphics card ID	0x3E92
Discrete graphics card model	AMD Radeon RX 550
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	4 GB
Discrete graphics memory type	GDDR5
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1200 MHz
Number of displays supported (on-board graphics)	3
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DisplayPort version	1.2
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity	0
Chassis type	Tower
Product color	Black
Country of origin	China
Placement supported	Vertical
Audio chip	Conexant CX20632
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel Q370
Power supply	500 W
Operating system architecture	64-bit
Sustainability certificates	ENERGY STAR
Scalability	1S
Processor ARK ID	126684
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015D
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	370 mm
Width	154 mm
Height	365 mm
Weight	9860 g

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Components with a surface area greater than 10 sq cm requiring selective treatment.

Batteries

All battery types, including alkaline and lithium coin or button styles.

Mercury-containing components

Components containing mercury, such as lamps, backlights, scanners, switches.

Liquid Crystal Displays (LCD)

LCDs with a surface area greater than 100 sq cm, including gas discharge lamp displays.

Electrolytic Capacitors / Condensers

Capacitors measuring greater than 2.5 cm in diameter or height.

Tools Required for Disassembly

Cross Type Screw Driver

A cross-type screw driver is required for disassembling the product.

Small Size Cut-Pliers

Small-sized cut-pliers are needed for specific disassembly tasks.

Product Disassembly Process

Access Panel Removal

Slide the latch and remove the access panel to start the disassembly process.

Component Disconnections

Disconnect power, SATA, and speaker cables from the Motherboard (MB).

Drive and Heatsink Removal

Remove HDD/ODD from chassis and detach the heatsink from the MB.

Motherboard and CPU Extraction

Remove the Motherboard (MB) from the chassis and extract the CPU.

PSU Removal and Capacitor Extraction

Unscrew PSU, disconnect cables, and remove electrolytic capacitors.