2. Remove the heat sink (2).
3. For computer models equipped with a graphics subsystem with UMA memory, in the order indicated on
the screws, remove the four Phillips PM2.0×3.0 screws (1) that secure the heat sink to the system board.
4. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal paste is used on the processor (1) and the heat sink component (2) that services it. Thermal paste is
also used on the graphics subsystem chip (3) and the heat sink component (4) that services it.
HP Condential
44 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
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