6. Remove the fan/heat sink assembly (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the fan/heat sink assembly and system board spare part kits.
On computer models equipped with a graphics subsystem with discrete memory: Thermal paste is used on
the processor (1) and the fan/heat sink assembly section (2) that services it. Thermal paste is also used on
the VGA component (3) and the fan/heat sink assembly section (4) that services it.
Component replacement procedures 47
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