7. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to detach
the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is
used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used on the
Northbridge chip (3), the graphics subsystem chip (4), and the sections of the heat sink (5) that service
them. Replacement thermal material is included with all fan/heat sink assembly, system board, and
processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with graphics subsystems with discrete memory.
100 Chapter 4 Removal and replacement procedures
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