HP Pro x2 612 G1 Maintenance And Service Guide

1. Release the ZIF connector (1) to which the TouchPad button board cable is attached, and then
disconnect the TouchPad button board cable from the TouchPad.
2. Remove the two Philllips PM1.9×2.4 screws (2) that secure the TouchPad button board to the top cover.
3. Remove the TouchPad button board (3).
Reverse this procedure to install the TouchPad button board.
Keyboard
For use in country or region Spare part number For use in country or region Spare part number
Keyboard with backlight and pointing stick (includes backlight,
keyboard, and pointing stick cables)
For use in the Netherlands 766641-B31
For use in Belgium 766641-A41 For use in Northwest Africa 766641-FP1
For use in Brazil 766641-201 For use in Norway 766641-091
For use in Bulgaria 766641-261 For use in Portugal 766641-131
For use in Canada 766641-DB1 For use in Romania 766641-271
For use in the Czech Republic
and Slovakia
766641-FL1 For use in Russia 766641-251
For use in Denmark 766641-081 For use in Saudi Arabia 766641-171
For use in France 766641-051 For use in Slovenia 766641-BA1
For use in Germany 766641-041 For use in South Korea 766641-AD1
For use in Greece 766641-151 For use in Spain 766641-071
For use in Hungary 766641-211 For use in Sweden and Finland 766641-B71
For use in Iceland 766641-DD1 For use in Switzerland 766641-BG1
Keyboard base replacement procedures 69

HP Pro x2 612 G1 Specifications

General

Form factor	Convertible (Detachable)
Product type	Hybrid (2-in-1)
Product color	Black
Country of origin	China
Market positioning	Business
Bus type	DMI2
Stepping	D0
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel® Core™ i3-4000 Mobile Series
Processor socket	BGA 1168
Processor threads	4
Processor codename	Haswell
Processor frequency	1.5 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	4x1, 2x4
Thermal Design Power (TDP)	11.5 W
Scenario Design Power (SDP)	6 W
Maximum number of PCI Express lanes	12
Motherboard chipset	-
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	SATA
Storage media	SSD
Total storage capacity	128 GB
Number of SSDs installed	1
Display diagonal	12.5 \
Touch technology	Multi-touch
Native aspect ratio	16:9
On-board graphics card ID	0x402
On-board graphics card model	Intel® HD Graphics 4200
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	2 GB
On-board graphics card base frequency	200 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	850 MHz
Display technology	IPS
Intel segment tagging	Enterprise, Small Business
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Operating system installed	Windows 8.1
Processor code	SR1C7
Processor ARK ID	76608
Intel TSX-NI version	0.00
Processor package size	40 x 24 x 1.5 mm
Intel ME Firmware Version	9.5
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology version	1.00
Battery capacity	29 Wh
Battery life (max)	- h

Weight and Dimensions

Width	- mm
Weight	- g