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HP ProDesk 490 G2 User Manual

HP ProDesk 490 G2
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Recommended materials and equipment
Materials and equipment that are recommended for use in preventing static electricity include:
Antistatic tape
Antistatic smocks, aprons, or sleeve protectors
Conductive bins and other assembly or soldering aids
Conductive foam
Conductive tabletop workstations with ground cord of one-megohm +/- 10% resistance
Static-dissipative table or floor mats with hard tie to ground
Field service kits
Static awareness labels
Wrist straps and footwear straps providing one-megohm +/- 10% resistance
Material handling packages
Conductive plastic bags
Conductive plastic tubes
Conductive tote boxes
Opaque shielding bags
Transparent metallized shielding bags
Transparent shielding tubes
Operating guidelines
To prevent overheating and to help prolong the life of the computer:
Keep the computer away from excessive moisture, direct sunlight, and extremes of heat and cold.
Operate the computer on a sturdy, level surface. Leave a 10.2-cm (4-inch) clearance on all vented sides
of the computer and above the monitor to permit the required airflow.
Never restrict the airflow into the computer by blocking any vents or air intakes. Do not place the
keyboard, with the keyboard feet down, directly against the front of the desktop unit as this also
restricts airflow.
Occasionally clean the air vents on all vented sides of the computer. Lint, dust, and other foreign matter
can block the vents and limit the airflow. Be sure to unplug the computer before cleaning the air vents.
Never operate the computer with the cover or side panel removed.
Do not stack computers on top of each other or place computers so near each other that they are
subject to each other’s re-circulated or preheated air.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be
provided on the enclosure, and the same operating guidelines listed above will still apply.
Keep liquids away from the computer and keyboard.
Operating guidelines 19

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HP ProDesk 490 G2 Specifications

General IconGeneral
Tcase72 °C
Bus typeDMI2
SteppingC0
Processor cache3 MB
Processor cores2
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-4100 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads4
Processor codenameHaswell
Number of QPI links0
Processor frequency3.7 GHz
Processor cache typeL3
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes32-bit, 64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)54 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM, DDR3L-SDRAM
Memory voltage supported by processor1.5 V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
On-board graphics card ID41
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.3
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD±RW
Total storage capacity500 GB
Intel segment taggingEnterprise, Small Business
Operating system installedFreeDOS
Operating system architecture64-bit
Wi-FiNo
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Placement supportedVertical
Product typePC
Motherboard chipsetIntel® H97
Power supply180 W
Power supply input voltage100 - 240 V
Power supply input frequency50 - 60 Hz
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Scalability1S
Processor codeSR1PL
Processor ARK ID77490
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2013C
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth358.8 mm
Width165 mm
Height355 mm
Weight6500 g

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