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HP ProLiant ML310e Specification

HP ProLiant ML310e
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HP ProLiant ML310e Gen8 v2, a single-socket 4U tower server, delivers essential availability and expansion needed to accommodate
changing business needs. It is ideal for remote sites and corporate branch offices running file/print, web messaging, and small vertical
applications or databases.
Front View:
Rear View:
1.
Quick removal access panel
1.
Power supply
2.
Power Supply
2.
NIC Connector 2
3.
Four DIMM slots
3.
NIC Connector 1
4.
Rear system fan (Processor cooling)
4.
UID LED Button
5.
Processor Heatsink
5.
iLO Dedicated LAN Port
6.
Four (4) PCIe expansion slots
6.
Two(2) USB 3.0 Connectors
7.
Front system fan (Expansion board cooling)
7.
Video Connector
8.
Half Height SATA DVD-ROM or DVD RW Optical Drive
8.
Serial Connector
9.
Media Drive Blank
9.
Slot 4 PCIe x16
10.
Power Button
10.
Slot 3 PCIe x8
11.
NIC Activity LED
11.
Slot 2 PCIe x8
12.
System Health
12.
Slot 1 PCIe x4
13.
UID LED button
13.
PCIe card bracket
14.
Four (4) USB connectors
15.
Four (4) LFF or Eight (8) SFF SAS/SATA HDD cage
What's New
Latest Intel® Pentium® and CoreTM i3 Desktop Series processors
Entry BTO SKU
QuickSpecs
HP ProLiant ML310e Generation 8 (Gen8) v2
Overview
DA - 14564 Worldwide — Version 11 — December 13, 2013
Page 1

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HP ProLiant ML310e Specifications

General IconGeneral
Bus typeDMI
SteppingC0
FSB ParityNo
Scalability1S
Processor cache8 MB
Processor cores4
Processor modelE3-1220V3
System bus rate5 GT/s
Processor seriesIntel Xeon E3-1200 v3
Processor socketLGA 1150 (Socket H3)
Processor codenameHaswell
Motherboard chipsetIntel® C222
Processor frequency3.1 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus- MHz
Processor boost frequency3.5 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x8, 1x16, 2x4, 2x8
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed1
Thermal solution specificationPCG 2013D
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM
Memory channels supported by processorDual
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
HDD size3.5 \
HDD speed7200 RPM
RAID levels0, 1, 10
HDD interfaceSerial ATA III
Optical drive typeDVD-RW
Total storage capacity1000 GB
Maximum storage capacity16 TB
Supported storage drive interfacesSAS, Serial ATA
Internal memory4 GB
Memory clock speed1333 MHz
Memory layout (slots x size)1 x 4 GB
Maximum graphics card memory16 MB
On-board graphics card modelNot available
Graphics cardG200
Graphics card familyMatrox
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeGigabit Ethernet
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
PCI Express slots version3.0
Operating system installed-
Compatible operating systemsWindows Server\\r Ubuntu\\r Red Hat Enterprise Linux\\r SUSE Linux Enterprise Server\\r VMware
Noise level26 dB
Chassis typeTower (4U)
Power supply350 W
Power supply input frequency47/63 Hz
CertificationFCC; CISPR 22; EN55022; EN55024; FCC CFR 47; ICES-003; CNS13438; GB9254; K22; K24; EN 61000-3-2; EN 61000-3-3; EN 60950-1; IEC 60950-1
Processor ARK ID75052
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth475.2 mm
Width175 mm
Height368.2 mm
Weight18960 g

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