HP V272 - Components, parts and materials containing radioactive substances; Tools Required for Disassembly; SCREW DRIVER(Plum flower head); Product Disassembly Process Steps

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screw on base.
2. Unscrew the screw on stand and pull out the stand.
3. Unscrew the screw on back cover and use tool to remove rear cover.
4. Remove the screw on the key board to remove key board.
5. Tear off all tapes, remove all screws and disconnect the connectors the separate the main frame and panel.
6. Dismantle the PCBA screws.
7. Take off board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).