HP xw4600 Quickspecs

Plastics parts weighing over 25 grams used in
the product are marked per ISO 11469 and
ISO1043.
Display meets the requirement for low
frequency electromagnetic fields per MPR-II,
TCO, and prEN50279 A/B/C.
This product contains 100% recycled materials
(by wt.)
This product is 100% recycleable when
properly disposed of at end of life.
Packaging Materials
Corrugated - 0.955 kg
Plastic (other) - 0.055 kg
Polystyrene - 0.24 kg
Material Usage This product does not contain any of the
following substances in excess of regulatory
limits (refer to the HP General Specification for
the
Environment at
http://www.hp.com/hpinfo/globalcitizenship/
environment/supplychain/gen_specifications.
html ):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants -
may not be used as flame retardants in
plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the
external surface designed to be
frequently handled or carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers
(PBBEs)
Polybrominated Biphenyl Oxides
(PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) - except for
wires and cables, and certain retail
packaging has been voluntarily removed
from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT),
QuickSpecs
HP xw4600 Workstation
Technical Specifications - Monitors
DA - 12792 Worldwide QuickSpecs — Version 19 — 9.12.2008 Page 54

HP xw4600 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Audio system	High Definition Audio
Product type	Workstation
Motherboard chipset	Intel® X38 Express
ECC	Yes
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD-RW
Graphics card	-
Networking features	Gigabit Ethernet (10/100/1000)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply	475 W
Chassis type	Tower
Country of origin	China
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm
On-board graphics card model	Not available

Weight and Dimensions

Depth	456 mm
Width	168 mm
Height	450 mm
Weight	19000 g