HP Z1

Environmental
Requirements
Temperature Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Humidity Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Maximum Altitude Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Dynamic (new) Shock
Operating: ½-sine: 40g, 2-3ms (~62 cm/sec)
Non-operating:
½-sine: 160 cm/s, 2-3ms (~105g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025 g²/Hz
Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Values represent individual shock events and do not indicate repetitive shock
events. Values do not indicate continuous vibration.
Cooling Above 5,000 ft (1524 m) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase
Physical Security and Serviceability
Access Panel Tool-less
Includes system board and memory information
Expansion Cards MXM graphics assembly is tool-less.
MiniPCIe cards are screw-in.
Processor Socket Tool-less, except for the processor heatsink.
Green User Touch Points Yes, on tool-free internal chassis mechanisms
Color-coordinated Cables
and Connectors
Yes
Memory Tool-less
System Board Screw-In for motherboard, Rear IO and Side IO boards.
Dual Color Power and HD
LED on Side of Computer
Yes
Configuration Record SW Yes
Over-Temp Warning on
Screen
Yes
Restore CD/DVD Set Restores the computer to its original factory shipping operating system. Orderable with the workstation,
or available from Support.
Dual Function Side Power
Switch
Causes a fail-safe power off when held for 4 seconds
Cable Lock Support Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft
3mm x 7mm slot at rear of system
QuickSpecs
HP Z1 Workstation
System Technical Specifications
DA - 14263 North America — Version 21 — October 4, 2013 Page 19