4. Remove the heat sink (4).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink
and the system board components, it may be necessary to move the heat sink from side to side to
detach it.
The following illustration shows the replacement thermal material locations on the system board and
the heat sink on computer models equipped with a graphics subsystem with discrete memory. The thermal
material must be thoroughly cleaned from the surfaces of the system board and the heat sink components
each time the heat sink is removed. Replacement thermal material is included with the system board and
heat sink spare part kits.
Thermal paste is used on the processor (1) and on the heat sink component (2) that services it. Thermal
paste is also used on the graphics subsystem component (3) and on the heat sink component (4) that
services it.
86 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ENWW
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