The following illustration shows the replacement thermal material locations on computer models equipped
with a graphics subsystem with UMA memory. The thermal material must be thoroughly cleaned from
the surfaces of the heat sink and the system board components each time the heat sink is removed.
Replacement thermal material is included with the heat sink, processor, and system board spare part kits.
Thermal paste is used on the processor (1) and on the heat sink component (2) that services it.
Reverse this procedure to install the heat sink.
ENWW Component replacement procedures 87
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